It is known that the packaging belongs to industrial and commercial fields. Although the packaging, testing and calibration importance and cost (70% of the manufacturing cost ) are more than even fabrication, it has gained less consideration in literature. However, the package must satisfy multiple functions including: protection (from the surrounding environment) connectivity (electrical, material transport, radiant energy, external force) compatibility (chip-to-package, package to PCB) routing (electrical, materials) mechanical stress control thermal management assembly simplification testability and rework ability.
Packaging in general terms is categorized in various subsections such as biological micro-electromechanical systems (bio MEMS) packaging, packaging of optoelectronics and radio frequency (RF) devices package. The packaging is a vital bridge between semiconductors and printed circuit boards (PCBs). Keywords: Packaging Micro-assembly Wire-bonding TAB Flip-chipping Adhesives Introduction Although this paper provides a platform to deal with some of the main 3D packaging challenges, the same techniques could be expanded for numerous applications and for mass production of MEMS devices. Additionally, a small vacuum chamber has been designed and manufactured to examine the mechanical response of MEMS devices under vacuum before fully package them. This packaging technique is known for its low cost and quick manufacturing capacity and it is also capable of building structures with bio-compatible materials. This article demonstrates adapting 3D printing for packaging of overhanging MEMS structures. An improvised approach of using flexible printed circuit boards (PCBs) as well as conventional solid PCBs is depicted to electrically bond MEMS prototypes and prepare for tests.
A low cost micro-dispensing technique has been developed to run precise dispensing using manual dispensers. For each specific technique, some examples are demonstrated which were developed or adapted in our lab. In addition, the main electrical interconnection techniques are investigated: wire-bonding, tape automated bonding (TAB), adhesive-based bonding, and flip-chipping. This article compiles the most important packaging techniques for micro electromechanical systems (MEMS).
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